ISSCC 2019 - Smart Cable
APEC 2019 - Multi-Inductor Hybrid (MIH) Converter Family
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ISSCC 2019 - Smart Cable
APEC 2019 - Multi-Inductor Hybrid (MIH) Converter Family
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Latest News

  • 02/2025 – We brought the complete Ph.D. student group to ISSCC 2025 and had a great time, including:
    • Hieu’s paper presentation at the Ubiquitous Power Delivery session.
    • A fantastic pre-ISSCC party and a pin-ball championship tournament at John and Johanna’s house (Casey’s good friends). Casey was the champion after 3 rounds.
    • Hangout with other friends and colleagues.
  • 01/2025 – Story to be told: In 9 months of 2023, Po-Han (proj. leader), Zhiheng, and Spencer successfully led a massive 25 sq-mm (iPower3Es’ record chip size) 256-channel stimulator chip design as a part of a very large, important $12M project, “Thin, High-Density, High-Performance, Depth and Surface Microelectrodes for Diagnosis and Treatment of Epilepsy,” funded by the National Institutes of Health (NIH) at UCSD to develop and enhance brain-sensing and brain-stimulating platform technologies to enable treatment of drug-resistant epilepsy.
    • The design was a big success with the highly integrated chip that includes both high-voltage high-current stimulator circuits and digital synthesis flow for comprehensive programmable stimulation mode and channel control.
    • The work will be featured in our paper “A Scalable 256-Channel 12-mA 0.06%-Current-Mismatch 22-V Neurostimulator with Real-time Current Calibration and Compliance Monitoring” at the 2025 CICC in Boston in April 2025.
    • Big congratulations to Po-Han, Zhiheng, Spencer, and the whole collaborator team!! You do make us proud!
  • 01/2025 – Happy New Year, everyone! May the new year bring you a lot of health, joy, happiness, and success. This year, we are going to show our research in several new territories that we have not been before, including integrated GaN power ICs and implantable brain-interface ICs with a large stimulator array.
    • Better yet, there are more to come. Stay tuned!

Welcome to iPower3Es

Research Mission

Our research mission is to address challenges in co-optimizing efficiency and size with performance in different electronic systems and applications, including:

  • High-performance computing and data centers
  • Mobile and automotive devices
  • Robots: futuristic ones
  • Communication systems
  • DC-houses and DC-buildings
  • Low-power biomedical implants
  • Internet of Things (IoTs)

Team

We are always looking for good team members. Outstanding and self-motivated students interested in joining the iPower3Es group are recommended to contact Prof. Le directly.

Our team combines individuals who love what we are doing for future energy-efficient electronics systems. We strongly support diversity in our group, department, and school where creativity is fostered together with a strong work ethic. And also very importantly, we have fun. 

Sponsors and Industry Collaborators

Research Center Participations

Companies and Institutions that Alumni Go to